That's so tacky!
I've been trying to read up on doing BGA rework with the hot air gun. Articles and youtube videos suggest making use of gel flux. Googling for gel flux was frustrating at first. At some point I can to the realization that gel is one word for a thing with a variety of words. When you're ordering from Digikey, Amazon, etc. you'll probably want to search for the term tacky flux to find what you want. Some people call it paste flux. All the same thing I guess, in terms of viscosity and why you use it over liquid. The only thing left is to figure out if you want no-clean (you probably do), water soluble, halide-free, lead-free or tin-lead compatiblecharacteristics in tacky/paste/gel form.
It sounds like this tacky/paste/gel flux is what you want to use while reballing a BGA. The tackiness helps hold a loose ball on each pad until you get it under heat for reflow to really attach the solder balls. And some people use it with solder wick/braid in cleaning old solder off the BGA pads before reball or reflow on the PCB board.
posted by Bill Toner @ 3:37 PM
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